| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a miniaturized, low-profile and cost-reduced electronic component capable of dealing with high-functional communication equipment or the like, in the electronic component including at least one piezoelectric oscillation portion and a connecting portion on a substrate. <P>SOLUTION: The electronic component includes at least one piezoelectric oscillation portion (2) and a connecting portion (3) provided on a substrate (1), and is equipped with: a recessed part (9) which does not obstruct the oscillation of the piezoelectric oscillation portion (2); and a structural piece 4 which is composed of a plate-like resin material including an electro-conductive wiring formed by filling a through hole 6 with an electro-conductive material 10 for electrically connecting a mounting wiring 7 formed on the upper surface of the structural piece (4) with a pad 5 on the substrate (1). The structural piece (4) seals the piezoelectric oscillation portion (2). The electronic component is used to easily form a wiring for electrically connecting the substrate and the mounting wiring and further to seal the piezoelectric oscillation portion in a space provided in the structural piece, thereby supplying the miniaturized, low-profile and cost-reduced electronic component. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
