| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a bonded structure for an electronic circuit device, which makes uniform the thickness of a bonding agent in between a circuit board and a base during the process of bonding, and hardening in between the two for further improving on heat radiation performance and reliability. <P>SOLUTION: When a bonding agent 5 is applied for bonding together a circuit board 3 and a base 4 with protrusions such as printed resistors crowding on an edge of the circuit board 3, an unsupported part droops under the weight of the circuit board 3 and this makes the bonding agent 5 thinner at the unsupported part. Since the bonding agent 5 at a protrusion-occupied part cannot be thinner than the thickness of the protrusion, a difference may occur there in the thickness of the bonding agent 5 when it is hardened. Heat radiation performance may grow irregular in the presence of a local difference in bond layer thickness, and this threatens separation of bonded surfaces. When protrusions 7 are built so that protrusions in the bonded surfaces between the circuit board 3 and the base 4 are arranged uniformly, the circuit board 3 is kept in equilibrium for the thickness of the bonding agent 5 to be prevented from growing uneven. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
