发明名称 |
Chip shaping for flip-chip light emitting diode |
摘要 |
A LED of flip-chip design comprises a light emitting region and one or more transparent substrates overlying the light emitting region. The light emitting region includes a negatively doped layer, a positively doped layer, and an active p-n junction layer between the negatively doped layer and the positively doped layer. At least one of the substrates has a pyramidal shape determined by (1) the composition of electrically conductive or electrically non-conductive material, (2) the number of side surfaces, (3) the degree of offset of an apex or top surface, and (4) the slope angle of each side surface relative to a bottom surface.
|
申请公布号 |
US6784460(B2) |
申请公布日期 |
2004.08.31 |
申请号 |
US20020268223 |
申请日期 |
2002.10.10 |
申请人 |
AGILENT TECHNOLOGIES, INC. |
发明人 |
NG KEE YEAN;KUAN YEW CHEONG |
分类号 |
H01L33/20;(IPC1-7):H01L29/267;H01L29/22;H01L29/227;H01L29/24 |
主分类号 |
H01L33/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|