Smart card manufacturing method for transport field, involves situating cavity at chip level so that card exists within cavity when sheet is placed on support and chip is not subjected to pressure during lamination

摘要

The method involves applying a thermoplastic sheet (62) on a support face of an antenna (40) with an integrated chip (50), and perforating the sheet with a transversal cavity. The cavity is situated at a level of the chip in such a way that the card exists within the cavity when the sheet is placed on the support before lamination and the chip is not subjected to any pressure during the lamination. The sheets thickness is greater than the thickness of the electronic module/chip by 5 percent.