发明名称 MODULAR IMPLANTABLE MEDICAL DEVICE
摘要 An implantable medical device (10, 80, 90, 120, 130, 140, 150, 170, 180) includes a plurality of separately housed and flexibly interconnected modules (30, 32, 34, 172, 182). A first module (30) includes a control electronics within a first housing (36), and may be coupled to a second module (32) that includes a second housing (38) by a flexible interconnect member (44, 46, 174, 184). In some embodiments, an overmold (48, 82, 92, 122, 132, 176, 186), which may be flexible, at least partially encapsulates the first and second housings. The second module may be a power source module that includes a power source, such as a rechargeable battery, within the second housing. The implantable medical device may also include a third module, such as a recharge module that includes a coil within a third housing. The overmold may at lest partially encapsulate the third housing, or the third module may be tethered to the overmold by a flexible tether member (124). A flexible interconnect member and/or flexible overmold may allow multiples degrees of freedom of movement between modules of an implantable medical device.
申请公布号 WO2004052456(B1) 申请公布日期 2004.08.26
申请号 WO2003US38939 申请日期 2003.12.09
申请人 MEDTRONIC, INC. 发明人 WAHLSTRAND, CARL, D.;SINGHAL, RUCHIKA;SKIME, ROBERT, M.
分类号 A61N1/36;A61N1/375;(IPC1-7):A61N1/375 主分类号 A61N1/36
代理机构 代理人
主权项
地址