| 发明名称 |
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent light invading into a semiconductor chip through the rear surface of the semiconductor chip. <P>SOLUTION: There is provided a light shielding layer 9 for interrupting the incidence of specific wavelength light on the rear surface of the semiconductor chip 1 constituting a chip-size package such that the external appearance of the light shielding layer 9 is coincident with that of the semiconductor chip 1. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
| 申请公布号 |
JP2004241673(A) |
申请公布日期 |
2004.08.26 |
| 申请号 |
JP20030030359 |
申请日期 |
2003.02.07 |
| 申请人 |
SEIKO EPSON CORP |
发明人 |
SATO SHINGO |
| 分类号 |
H01L23/29;H01L21/60;H01L23/12;H01L23/31;(IPC1-7):H01L23/29 |
主分类号 |
H01L23/29 |
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