发明名称 ALKALI SOLUBLE CONDUCTIVE PASTE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a conductive paste composition which is suitable to use for a method of construction having a superior productivity without using an expensive metal mask, and which is superior in storage stability and filling performance into a via-hole in manufacturing a multilayer ceramic substrate. SOLUTION: This alkali-soluble conductive paste composition contains (A) an alkaline-soluble polymer binder, (B) a conductive metal powder, and (C) an organic acid, and this is suitably used for the method of construction in which a layer of the alkali-soluble conductive paste composition formed on the substrate is patternized via the pattern of the conductive paste which is insoluble in an alkaline aqueous solution provided on the upper layer. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004241238(A) 申请公布日期 2004.08.26
申请号 JP20030028509 申请日期 2003.02.05
申请人 TAIYO INK MFG LTD 发明人 OZAWA SATOSHI;ONISHI SHIGEKATSU
分类号 H01B1/22;(IPC1-7):H01B1/22 主分类号 H01B1/22
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