| 摘要 |
PROBLEM TO BE SOLVED: To prepare a film-forming coating liquid which is useful in forming a low dielectric constant insulation film, gives the insulation film having good adhesion to wiring and other parts, does not allow the insulation film to peel by the stress in a semiconductor device, and moreover gives the insulation film having not so high hygroscopicity. SOLUTION: The film-forming coating liquid is constituted by containing at least a first film-forming component having small polarity of its molecule and a high molecular weight and a second film-forming component having larger polarity of its molecule and a lower molecular weight than the first film-forming component. COPYRIGHT: (C)2004,JPO&NCIPI
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