| 摘要 |
Polishing pads having a surface morphology that results in a high degree of planarization efficiency when planarizing a wafer surface are disclosed. One conditioned polishing pad is non-porous and has a surface height distribution with a surface roughness Ra<3 microns. Another conditioned polishing pad is porous and has a surface height probability distribution with a pad surface height Ratio R>=60%, or alternatively has an asymmetric surface height probability distribution characterized by an asymmetry factor A10<=0.50. Methods of pad conditioning and planarizing a wafer using the polishing pads are also disclosed.
|
