METHOD FOR PLANARIZING BUMPED DIE

摘要

According to one embodiment of the invention, a method for planarizing bumped die includes providing a die having a plurality of stud bumps, encapsulating the stud bumps with an epoxy-based material, and disposing a release layer outwardly from the epoxy-based material. A surface of the release layer that engages the epoxy-based material is substantially planar. The method further includes curing the epoxy-based material and removing the release layer after the curing step, thereby creating a substantially planar surface of the epoxy-based material.