| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a device for flattening a film of a material in a product such as a semiconductor wafer. <P>SOLUTION: A device is provided with a shaft which has a shaft stem and is connected to a polishing head connected to a polishing pad. The diameter of the polishing pad is smaller than that of an object to be flattened. The shaft can rotate so that it rotates the polishing head and the polishing pad around a shaft stem. An orbit housing has an eccentric hole detached from an orbit shaft, and the shaft is arranged to rotatably pass through the eccentric hole. The orbit housing can rotate to move the shaft, the polishing head and the polishing pad on an orbit around the orbit shaft. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
