THERMOELECTRIC MODULE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a thermoelectric module exhibiting excellent water resistance in which a heat leak from the heat dissipation side to the heat absorption side is reduced. SOLUTION: In the thermoelectric module, p-type thermoelectric semiconductor elements and n-type thermoelectric semiconductor elements arranged in parallel are connected in series through electrodes on upper and lower end faces thereof and insulating substrates are secured to outer surfaces of upper and lower electrodes. A air gap between the thermoelectric semiconductor elements and a gap between the substrates forming a pair structure through the thermoelectric semiconductor elements are filled with porous bodies each having an organic silyl group at least partially on the surface thereof. COPYRIGHT: (C)2004,JPO&NCIPI