| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition which disperses a metallic powder into a molded product and can easily depict a fine circuit of a desired thickness, and to provide a circuit board obtained by using the same. SOLUTION: The epoxy resin composition for a circuit board comprises the metallic powder having an insulation film on its surface, an epoxy resin, and a compound having an imidazole ring as its curing catalyst and has properties such that (a) the gelling time is 20 sec to 80 sec and (b) the melt minimum viscosity at 180°C measured by a flow tester is 15 Pa s to 180 Pa s. The circuit board is obtained by irradiating a resin board obtained by molding the epoxy resin composition with a laser beam along a circuit pattern to thereby carve the resin board to expose the metallic powder, then treating the resulting resin board with a liquid chemical for removing the insulation film of the metallic powder, and subjecting the obtained resin board to plating treatment. COPYRIGHT: (C)2004,JPO&NCIPI
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