发明名称 Method and apparatus for examining semiconductor wafers in a context of die/SAW design
摘要 The invention takes into account the fact that the size of the SAWs varies greatly depending on the stepper and the die size (design). In general, it cannot be assumed that one SAW can be imaged with one camera image. A SAW is preferably broken down into regular logical parts (segments) of identical size. A SAW index is allocated to each logical SAW segment. One image field of the camera can image only a certain number of these SAW segments. An index, hereinafter called an image field segment index, is allocated to each segment of an image field, hereinafter called an image field segment.
申请公布号 US2004165764(A1) 申请公布日期 2004.08.26
申请号 US20040772510 申请日期 2004.02.05
申请人 LEICA MICROSYSTEMS SEMICONDUCTOR GMBH 发明人 MICHELSSON DETLEF
分类号 G01N21/95;G01N21/956;(IPC1-7):G06K9/00 主分类号 G01N21/95
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