发明名称 |
Heatsink arrangement for semiconductor device |
摘要 |
A heatsink arrangement attached to a semiconductor device includes: a first heatsink placed in close contact with the semiconductor device; and second heatsink placed in close contact with the first heatsink, wherein the first heatsink and the second heatsink are connected to a power supply circuit for the semiconductor device via first connector and second connector, respectively. Thus, the present invention provides a heatsink arrangement for a semiconductor device used in an electric/electronic circuit that radiates less high-frequency noise even when a large current flows through the semiconductor device and that provides a high heat-radiating efficiency.
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申请公布号 |
US2004164405(A1) |
申请公布日期 |
2004.08.26 |
申请号 |
US20030741472 |
申请日期 |
2003.12.18 |
申请人 |
UMEZU NORIO;HISAMOTO SADATOSHI;MURAYAMA KAZUTAKA |
发明人 |
UMEZU NORIO;HISAMOTO SADATOSHI;MURAYAMA KAZUTAKA |
分类号 |
H01L23/36;H01L23/367;H01L23/373;H05K1/02;(IPC1-7):H01L23/34 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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