| 摘要 |
<p>A semiconductor packaging apparatus for preventing cracking and delamination in a packaged semiconductor chip by controlling the die attach fillet height. Specifically, the present invention controls the die attach material height, thereby controlling the die attach fillet height, and thereby reducing shear stress in the die itself. Advantages of the present invention include increasing wire-bond reliability and package reliability without the need for requalification of existing products. By using currently qualified molding compounds and die attach epoxies in conjunction with the present technique for controlling the die attach epoxy height in order to control the die attach fillet height, the overall assembly process may be maintained. Thus, neither thermal performance nor electrical performance is compromised.</p> |
