| 摘要 |
PROBLEM TO BE SOLVED: To simply manufacture a thin multilayered printed wiring board excellent in mechanical strength in a build-up type manufacturing method for the multilayered printed wiring board. SOLUTION: This adhesive film comprises a support base film and the layer of a thermally flowable thermosetting resin composition solid at the normal temperature, which has physical properties of the oblique line region S of the figure in image in a temperature-melt viscosity relation, laminated on the support base film and having an area equal to or smaller than that of the support base film. The support base film is a heat-resistant film with a metal foil which comprises a metal foil with a thickness of 3-20μm and a heat-resistant film layer with a glass transition temperature of 200°C or above and a thickness of 3-30μm and the resin composition layer is formed on the surface of this film to form an interlaminar insulating adhesive film. The multilayered printed wiring board is manufactured by laminating the interlaminar insulating adhesive film on one side or both sides of a patterned circuit board under a vacuum heating and pressure condition and thermally curing the film to integrate the film with the patterned circuit board. COPYRIGHT: (C)2004,JPO&NCIPI |
