BOARD FOR PRINTED CIRCUIT AND PRINTED CIRCUIT BOARD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To industrially provide a board for a plating type flexible printed circuit high in the initial adhesion force with the plated copper layer formed on a heat-resistant resin film and having high adhesion force and excellent durability after allowed to stand for a long time under a moist heat condition after the loading of heat. SOLUTION: In the board for the printed circuit constituted by successively laminating a heat-resistant resin layer (B) and a conductive metal layer (C) on at least one side of a heat-resistant insulating film (A), heat-resistant resin particles (D) different from a main resin component constituting the heat-resistant resin layer (B) are added to the heat-resistant resin layer (B). COPYRIGHT: (C)2004,JPO&NCIPI