| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrolytic polishing pad which enables positive and good polishing even in the case of combination of CMP and electrolytic polishing. SOLUTION: The electrolytic polishing pad 3 has a polishing surface on which a workpiece 1 is pressed and slid, and an electrode surface located on an electrode side opposite to the polishing surface, and carries out electrolytic polishing in an electrolytic solution 5 while the workpiece 1 is kept to be pressed and slid on the polishing surface. Herein the polishing surface is formed of a polyvinyl acetal material having continuous pores penetrating through the polishing surface and the electrode surface. Then a mean pore size of the continuous pores is set to a range of 50 to 150μm, and a ratio of the pores is set to 80 % or more by volume. COPYRIGHT: (C)2004,JPO&NCIPI
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