发明名称 Method of manufacturing a semiconductor light emitting device, semiconductor light emitting device, method of manufacturing a semiconductor device, semiconductor device, method of manufacturing a device, and device
摘要 When a semiconductor light emitting device or a semiconductor device is manufactured by growing nitride III-V compound semiconductor layers, which will form a light emitting device structure or a device structure, on a nitride III-V compound semiconductor substrate composed of a first region in form of a crystal having a first average dislocation density and a plurality of second regions having a second average dislocation density higher than the first average dislocation density and periodically aligned in the first region, device regions are defined on the nitride III-V compound semiconductor substrate such that the device regions do not substantially include second regions, emission regions or active regions of devices finally obtained do not include second regions.
申请公布号 US2004164308(A1) 申请公布日期 2004.08.26
申请号 US20030719206 申请日期 2003.11.21
申请人 ASATSUMA TSUNENORI;TOMIYA SHIGETAKA;TAMAMURA KOSHI;TOJO TSUYOSHI;GOTO OSAMU;MOTOKI KENSAKU 发明人 ASATSUMA TSUNENORI;TOMIYA SHIGETAKA;TAMAMURA KOSHI;TOJO TSUYOSHI;GOTO OSAMU;MOTOKI KENSAKU
分类号 C30B25/02;H01L21/20;H01L33/00;H01L33/02;H01L33/16;H01L33/32;H01S5/02;H01S5/20;H01S5/22;H01S5/223;H01S5/323;H01S5/343;H01S5/40;(IPC1-7):H01L33/00 主分类号 C30B25/02
代理机构 代理人
主权项
地址