| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To enable to carry out electric connection such as wire-bonding jointing of an electrode of a semi-conductor chip with high precision and without increasing a manufacturing cost. <P>SOLUTION: This is a connector 30 mounted on a printed circuit board in order to carry out the electric connection to the electrode on the semi-conductor chip, and is provided with a substrate 30a composed of an insulating body, a boss part 30b in order to temporarily fix the substrate 30a to the printed circuit board, a plurality of lead pins 30c supported by the substrate 30a having first terminals 30d wired to the electrode on the semi-conductor chip at one end part and having second terminals 30e electrically connected to the printed circuit board at the other end part, and formed so that the spacing between the second terminals 30e is larger than that between the first terminals 30d, and a position detection marking part 30g which is installed on the first terminals 30d side of the lead pins 30c of the substrate 30a and detects the position of the first terminals 30d. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
