发明名称 METHOD AND DEVICE FOR FLUIDIZING HOT AIR INSIDE FURNACE IN REFLOW TYPE SOLDERING DEVICE
摘要 PROBLEM TO BE SOLVED: To solve the problems that, by the ununiformity of the wind velocity of hot air stirred by the inhalation and exhaust of a circulation fan motor, the drift of the hot air by an air pocket occurs at the inside of a furnace, and that there occurs fine packaging misregistration in an electronic component on the object to be soldered by the nonuniformity of the wind velocity. SOLUTION: In the method for fluidizing hot air at the inside of the furnace in the device where hot air at the inside of a furnace is fluidized, the object to be soldered introduced into the furnace is brought into contact with the fluidized hot air to melt solder on the object to be soldered, and further, an electronic component packaged on the object to be soldered is soldered to the object to be soldered, a nozzle communicated with the pressure feed device provided at the outside of the furnace, and a reflector repelling injected gas from the nozzle to the hot air at the inside of the furnace are arranged, so that gas is blown on the inside of the furnace under pressure to be fluidized. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004237303(A) 申请公布日期 2004.08.26
申请号 JP20030027671 申请日期 2003.02.04
申请人 KOKI TEC CORP 发明人 NOSAKA SATORU
分类号 B23K31/02;B23K1/00;B23K101/42;H05K3/34;(IPC1-7):B23K31/02 主分类号 B23K31/02
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