发明名称 Interleaving method and apparatus with parallel access in linear and interleaved order
摘要 An interleaving method and apparatus provides parallel access in a linear and interleaved order to a predetermined number of stored data samples. A memory array with a plurality of memory devices is addressed by applying a first portion of an address to memory devices and by using a second portion of the address to select at least one memory device to be accessed, wherein the position of the first and second portions within the address is changed in response to a change between the linear order and the interleaved order. Due to the fact that the memory array is split into several individually addressable memory devices, each of these memory devices can be accessed in a linear and interleaved order by changing an allocation of a chip selection portion and a chip addressing portion of the address.
申请公布号 US2004168011(A1) 申请公布日期 2004.08.26
申请号 US20030611919 申请日期 2003.07.03
申请人 HEMMING ERWIN 发明人 HEMMING ERWIN
分类号 H03M13/27;(IPC1-7):G11C5/00 主分类号 H03M13/27
代理机构 代理人
主权项
地址