发明名称 |
Electronic substrate, power module and motor driver |
摘要 |
<p>An electronic substrate is used to mount a plurality of semiconductor chips thereon. The substrate includes a first conductive member, a second conductive member, and an insulating layer. The first conductive member is electrically connected to one of the semiconductor chips. The second conductive member is electrically connected to another one of the semiconductor chips. The insulating layer is arranged to electrically isolate the second conductive member from the first conductive member. The first conductive member is a conductive base that supports the insulating layer, the semiconductor chips and the second conductive member thereon. <IMAGE> <IMAGE></p> |
申请公布号 |
EP1434268(A3) |
申请公布日期 |
2004.08.25 |
申请号 |
EP20030029242 |
申请日期 |
2003.12.18 |
申请人 |
YAMAHA HATSUDOKI KABUSHIKI KAISHA |
发明人 |
MORITA, KOJI;YOSHIKAWA, TAKAO;MURAI, TAKAYUKI |
分类号 |
H01L25/07;(IPC1-7):H01L25/07;H01L23/485;H01L23/373 |
主分类号 |
H01L25/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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