CMP APPARATUS

摘要

PURPOSE: A CMP apparatus is provided to improve polishing uniformity of a wafer by expanding uniformly a membrane in a polishing process. CONSTITUTION: A polishing pad is installed on an upper surface of a platen. A polishing head(200) is used for polishing a semiconductor substrate by pressing the semiconductor substrate on the polishing pad. The polishing head includes a support plate(224) installed on a bottom of the polishing head, a membrane(240) having a pressing part, the first fixing part, and the second fixing part, and a clamp(226) for fixing the membrane. A plurality of holes are formed on the support plate. A plurality of holes are formed on the pressing part.