METHOD FOR SELECTIVELY REMOVING POLYIMIDE ORGANIC ALIGNMENT LAYER APPLIED TO GLASS SUBSTRATE WHERE NEGATIVE PHOTORESIST IS FORMED BY USING PLASMA WHILE REPRODUCING GLASS SUBSTRATE

摘要

PURPOSE: A method for selectively removing a polyimide organic alignment layer applied to a glass substrate where a negative photoresist is formed by using plasma while reproducing the glass substrate is provided to selectively remove a polyimide organic alignment layer only applied to a negative photoresist by using dry plasma, thereby effectively reproducing a substrate. CONSTITUTION: A polyimide organic alignment layer(102) is applied to a negative photoresist forming glass substrate. The negative photoresist forming glass substrate is injected into a reaction chamber(10) while maintaining pressure at 100 to 900mTorr. The pressure is maintained by injecting O2/N2 mixed gases within the reaction chamber(10). Plasma is generated by applying power to an electrode of a plasma reaction device. The polyimide organic alignment layer(102) is selectively dissolved.