发明名称 UPPER PNEUMATICS ASSEMBLY OF WAFER CMP EQUIPMENT
摘要 PURPOSE: An upper pneumatics assembly of wafer CMP equipment is provided to prevent malfunction by minimizing the amount of heat generated from a motor. CONSTITUTION: A regulator(110) is used for regulating the pneumatic supplied to a polishing head. A manifold(120) is used for transmitting the pneumatic to various paths of the polishing head through the regulator. A measuring converter is used for measuring the pneumatic. A fixing plate(140) is installed at a top part of a motor for rotating the polishing head. The manifold is installed at the fixing plate. A bridge(150) is used for separating the manifold from the fixing plate in order to prevent the transmission of the heat from the motor to the manifold.
申请公布号 KR20040074272(A) 申请公布日期 2004.08.25
申请号 KR20030009796 申请日期 2003.02.17
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KANG, HYEON GU
分类号 H01L21/304;(IPC1-7):H01L21/304 主分类号 H01L21/304
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