发明名称 |
UPPER PNEUMATICS ASSEMBLY OF WAFER CMP EQUIPMENT |
摘要 |
PURPOSE: An upper pneumatics assembly of wafer CMP equipment is provided to prevent malfunction by minimizing the amount of heat generated from a motor. CONSTITUTION: A regulator(110) is used for regulating the pneumatic supplied to a polishing head. A manifold(120) is used for transmitting the pneumatic to various paths of the polishing head through the regulator. A measuring converter is used for measuring the pneumatic. A fixing plate(140) is installed at a top part of a motor for rotating the polishing head. The manifold is installed at the fixing plate. A bridge(150) is used for separating the manifold from the fixing plate in order to prevent the transmission of the heat from the motor to the manifold.
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申请公布号 |
KR20040074272(A) |
申请公布日期 |
2004.08.25 |
申请号 |
KR20030009796 |
申请日期 |
2003.02.17 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KANG, HYEON GU |
分类号 |
H01L21/304;(IPC1-7):H01L21/304 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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