| 摘要 |
Memory cells are arranged such that one-bit data is stored by two-bit memory cells. The cell plate electrode of the memory cell capacitor and the gate electrode of the memory cell transistor are formed in the same manufacturing step. The amplitude of an isolation control signal applied to a bit line isolation gate connecting the bit line and the sense amplifier is restricted, and the word line is driven according to a negative voltage non-boosted word line scheme. A well region where a memory block is formed and a well region where the isolation gate is formed are separately provided, and separate bias voltages are applied thereto. Thus, a DRAM (dynamic random access memory)-based logic merged memory is implemented without degrading dielectric breakdown characteristics of the gate insulating film.
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