| 发明名称 |
Methods for providing void-free layers for semiconductor assemblies |
| 摘要 |
A method of providing a substantially void free layer for one or more flip chip assemblies, or one or more microelectronic components, utilizing a curable encapsulant. Also disclosed is a method of injecting an encapsulant into an assembly and a method of treating a microelectronic component to form a void free layer.
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| 申请公布号 |
US6780747(B2) |
申请公布日期 |
2004.08.24 |
| 申请号 |
US20020097032 |
申请日期 |
2002.03.13 |
| 申请人 |
TESSERA, INC. |
发明人 |
DISTEFANO THOMAS H.;FJELSTAD JOSEPH |
| 分类号 |
H01L21/56;H01L21/68;H01L23/31;H01L23/495;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/56 |
| 代理机构 |
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