发明名称 SURFACE EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME, ESPECIALLY INCREASING THE CONTACT AREA BETWEEN THE UPPER CONTACT LAYER AND THE UPPER OHMIC METAL LAYER
摘要 PURPOSE: A surface emitting diode and a method for manufacturing the same are provided to maintain a low resistance at the interface by increasing the contact area between the upper contact layer and the upper ohmic metal layer, so reducing driving current. CONSTITUTION: A surface emitting diode includes a substrate(10), a bottom contact layer(30), a light emitting layer(50), a top contact layer(70), a top ohmic metal layer(80) and a bottom ohmic metal layer(90). The bottom contact layer is prepared on the substrate. The light emitting layer is formed on the bottom contact layer and provided with an active layer and a pair of clad layers. The top contact layer is formed on the light emitting layer and provided with a concave or convex portion. The top ohmic metal layer is formed on the top contact layer. And, the bottom ohmic metal layer is ohmic contacted to one side of the bottom contact layer.
申请公布号 KR100446596(B1) 申请公布日期 2004.08.23
申请号 KR19970017400 申请日期 1997.05.07
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD.;SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, TAEK
分类号 H01S3/00;(IPC1-7):H01S3/00 主分类号 H01S3/00
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