| 摘要 |
PROBLEM TO BE SOLVED: To provide a test method capable of easily and quantitatively evaluating conductor adhesion strength with respect to lateral stress of a printed wiring board material and a printed wiring board with respect to lateral stress. SOLUTION: A test piece is fabricated by forming aϕ3 to 5 mm conductor land and soldering a predetermined connection terminal under predetermined conditions. Use is made of a general peeling strength test apparatus (autograph) as a test apparatus. The conductor adhesion strength test method is adapted such that, in the evaluation of the conductor adhesion property of a printed wiring board copper clad laminate, a pre-preg, a resin-equipped copper foil, and the printed wiring board, lateral stress is supposed when the parts are mounted on the substrate for the evaluation. The terminal is soldered onto the conductor land formed by etching, and a load for pulling down (or pushing down) the terminal laterally is measured for easy and quantitative evaluation. COPYRIGHT: (C)2004,JPO&NCIPI
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