| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayered printed board that functions as the circuit board of electric equipment, is composed of two or more printed boards, and is improved in connection reliability between circuits of different circuit boards by preventing laminate deviations (positional deviations of the circuits) caused by pressurization and forming through holes. SOLUTION: At the time of manufacturing the multilayered printed board by laminating a plurality of printed boards upon another and bonding the circuit boards to each other, a liquidized thermosetting bonding agent is made to flow between the printed boards after the printed boards are laminated upon another by positioning the boards. Thereafter, the printed boards are bonded to each other by setting the liquidized thermosetting bonding agent packed between the printed boards by heating the agent. COPYRIGHT: (C)2004,JPO&NCIPI |
