| 摘要 |
PROBLEM TO BE SOLVED: To provide equipment for inspecting a semiconductor device, in which the labor for replacing a probe card can be saved when one chip is measured for a plurality of times individually. SOLUTION: The inspection equipment comprises a probe card 2 including probes 3a of first group, probes 3b of second group, and a substrate 4 supporting the probes of first and second groups, and a means 7 for adjusting the position such that the probes of first group touch the pads of first group on a first semiconductor chip and the probes of second group touch the pads of second group on a second semiconductor chip adjacent to the first semiconductor chip, moving a semiconductor wafer at a specified pitch to the probe card when a semiconductor chip being measured is replaced, and adjusting the position such that the probes of first group touch the pads of first group on the second semiconductor chip and the probes of second group touch the pads of second group on a third semiconductor chip adjacent to the second semiconductor chip . COPYRIGHT: (C)2004,JPO&NCIPI
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