| 摘要 |
PROBLEM TO BE SOLVED: To provide a carrier tape which minimizes the adhesion of dust generated in the manufacture of the carrier tape, because the problem of quality is caused by the adhesion, for example, of the dust such as slitting chips, adhering to the surface part of the carrier tape, to an electronic component. SOLUTION: A device equipped with a dust removing method sucks in and removes the dust such as the slitting chips on both the end surfaces of the carrier tape after chipping off the dust with a razor's edge, in the manufacture of the carrier tape for the electronic component, which has embossed parts for the storage of the electronic component, arranged in a multi-row manner at fixed intervals in a longitudinal direction by thermoforming a thermoplastic tape-like object. COPYRIGHT: (C)2004,JPO&NCIPI
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