发明名称 Thermally optimized conductive block
摘要 A thermally conductive member is disclosed. In one embodiment, an apparatus has a thermally conductive member having a cavity at a first end, the first end of the thermally conductive member to communicate with a heat dissipating device and a second end of the thermally conductive member to communicate with a heat generating device. In another embodiment, the cavity is to accept an insulating material. In a further embodiment, the thermally conductive member is integrated with an enclosure of a computing device.
申请公布号 US2004159935(A1) 申请公布日期 2004.08.19
申请号 US20030367264 申请日期 2003.02.14
申请人 GHOSH PROSENJIT 发明人 GHOSH PROSENJIT
分类号 H01L23/34;H01L23/367;(IPC1-7):H01L23/34 主分类号 H01L23/34
代理机构 代理人
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