| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an improved multilayer PCB that realizes high-speed connections among electronic components mounted on a substrate. <P>SOLUTION: An electronic component 77, having two multilayer portions 20, which is provided with a multilayer PCB 30 having the portions 20 and onto whose PCB one of the multilayer portions is mounted can be electrically connected so that high-frequency connections among the electronic components, is assured. Since this PCB further has a conventional PCB portion 31, it can not only lower the cost, but assures a structure that has an overall thickness suited for use in the PCB area. Further, connections are possible from these parts to internal portions. In addition, a method of manufacturing such a structure is provided. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
