ADHESIVE FILM FOR GRINDING REAR SURFACE OF SEMICONDUCTOR WAFER AND METHOD FOR GRINDING REAR SURFACE OF SEMICONDUCTOR WAFER USING SAME

摘要

PROBLEM TO BE SOLVED: To provide an adhesive film for grounding the rear surface of a semiconductor wafer having excellent adhesive properties to and low contaminable characteristic of the front surface of the wafer. SOLUTION: An adhesive layer is formed of the adhesive which contains an acrylic adhesive polymer prepared by emulsion polymerization and containing an alkyl (meth)acrylic ester main monomer unit (A) of 50-98 wt%, a monomer unit (B) having a functional group capable of being reacted with a crosslinking agent of 1-40 wt% and an acrylic acid derivative carboxylic acid monomer unit (C) of 1-20 wt%, and the crosslinking agent having two or more functional groups in one molecule of 0.1-15 pts.wt. to the adhesive polymer of 100 pts.wt. COPYRIGHT: (C)2004,JPO&NCIPI