| 摘要 |
<P>PROBLEM TO BE SOLVED: To make a case molded with a molding die horizontal to the installation surface without machining the case member. <P>SOLUTION: An electronic component mounting apparatus comprises an electronic component supply device for handling the electronic components, a substrate transport, the case 6 having these mounted thereon and molded with a molding die, and at least one grounding leg 7 provided in the lower side of the case 6. The grounding leg 7 has a nut 8 passing through a hole 6a1 made in the lower side of the case 6, a bolt 9 passing through the lower side of the case 6 to be screwed into the nut 8, and a grounding material 10 engaged with the bolt 9 and installed on an installation surface G. A horizon adjusting mechanism 11 is provided for adjusting the tilt of the nut 8 independently of the tilt condition of the lower side of the case 6. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
