发明名称 MOUNTING STRUCTURE OF BUILT-IN DEVICE, AND ELECTRONIC DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide the mounting structure of a built-in device capable of preventing excessive shocks on the built-in device installed in a casing, and an electronic device employing the mounting structure. <P>SOLUTION: A reinforcing member 3 is formed by setting a second space s2 with a casing 2 through an interpolation member 6 in the bottom of the casing 2 equivalent to the installing place of a built-in device 1, an attaching tool 4 extended in a height direction is fixed to the reinforcing member 3, and the built-in device 1 is fixed in the reinforcing member 3 by the attaching tool 4 and installed in the casing 2. A first shock absorbing member 9 is disposed in a first space s1 between the built-in device 1 and the reinforcing member 3, and a second shock absorbing member 10 is disposed in the second space s2 between the reinforcing member 3 and the bottom of the casing 2. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p>
申请公布号 JP2004234740(A) 申请公布日期 2004.08.19
申请号 JP20030020901 申请日期 2003.01.29
申请人 SONY CORP 发明人 NAGAI MASATAKE;MICHIWAKI YUTAKA
分类号 H05K7/12;G06F1/16;G11B25/04;G11B33/08;G11B33/12;(IPC1-7):G11B33/08 主分类号 H05K7/12
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