| 摘要 |
PROBLEM TO BE SOLVED: To provide a die cooling method and a die cooling device capable of making cooling water uniformly contact with an inner surface of a cooling hole even when the cooling hole is formed upwardly in a substantially perpendicular direction in a die. SOLUTION: The die cooling device 1 has a cooling pipe 10. The cooling pipe 10 comprises an outer pipe 11 and an inner pipe 12 which are concentric with each other. A space between the outer pipe 11 and the inner pipe 12 forms an outer flow passage 1a, and a space within the inner pipe 12 forms an inner flow passage 1b. Cooling water feed means 22 and 26 are connected to the outer flow passage 1a, and air feed means 23 and 27 are connected to the inner flow passage 1b. The die cooling method comprises a cooling water feed step of feeding cooling water to the outer flow passage 1a by the cooling water feed means 22 and 26, and an air feed step of feeding air to the inner flow passage 1b by the air feed means 23 and 27. COPYRIGHT: (C)2004,JPO&NCIPI
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