| 发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING RESIN PATTERN USING THE COMPOSITION |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition and a method for forming a resin pattern using the composition. <P>SOLUTION: A photosensitive resin composition which contains a catalytic metal element having metal precipitation catalyst activity in electroless metal plating treatment as a catalyst precursor is disclosed. The method has an advantageous effect capable of selectively forming conductor films only on the resin patterns obtained by exposing and developing the photosensitive resin composition by incorporating the catalyst element having the metal precipitation catalyst activity in electroless metal plating treatment into the photosensitive resin composition. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
| 申请公布号 |
JP2004233835(A) |
申请公布日期 |
2004.08.19 |
| 申请号 |
JP20030024257 |
申请日期 |
2003.01.31 |
| 申请人 |
ROHM & HAAS ELECTRONIC MATERIALS LLC |
发明人 |
KONDO MASAKI;KANDA TAKASHI |
| 分类号 |
G03F7/004;C23C18/30;C23C18/31;C23C18/48;G03F7/038;G03F7/039;G03F7/40;H05K3/18 |
主分类号 |
G03F7/004 |
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