| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining device capable of reducing irregular concentration in a vicinity of a laser beam irradiation spot by suppressing deposition of debris in a vicinity of a portion to be machined, and enhancing the machining accuracy and the manufacturing yield by reducing remaining portions at a boundary of laser beam irradiation. <P>SOLUTION: An aperture mask 45 is provided immediately above a substrate. Since the size of an aperture part 45a of the aperture mask 45 is substantially the same as or less than that of a pattern processing part, laser beams are incident on the aperture mask 45, and transmitted only through the aperture part 45a of the aperture mask 45, and a thin film is irradiated with laser beams and machined. The irradiated thin film portion is sublimed, and rises, a part of the molecules are re-bonded in air, and drop downward, but not deposited on the substrate through they are deposited on the aperture mask 45. Therefore, irregular concentration caused by debris after the pattern processing does not occur. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
