发明名称 APPARATUS FOR PARTIALLY PLATING METALLIC TERMINAL
摘要 PURPOSE: An apparatus for partially plating metallic terminal is provided to effectively plate gold on a required part of the metallic terminal only in the process of continuously plating the metallic terminal. CONSTITUTION: The apparatus comprises a supply pipe(20) both sides of which are horizontally fixed by supports(10), to one side of which a hose for injecting a molten gold solution is connected, and on the outer lower surface of which a plurality of injection holes(21) are longitudinally formed; first electrode rod(30) which is horizontally installed at a lower side of the supply pipe, and to which a positive electrode is connected from the outside; a guiding plate(40) one side of which is inserted between the supply pipe and the first electrode rod, and the other side of which is inclined so that the molten gold solution injected from the injection holes flows down along the inclined guiding plate, wherein a tip(41) corresponding to terminal part(110) of the metallic terminal(100) is formed on an end of the other side of the guiding plate; a cover(50) which covers the outer side of the supply pipe, first electrode rod and guiding plate together, and into which the molten gold solution injected onto the guiding plate is absorbed; and second electrode rod(60) which is contacted with one side of the metallic terminal, and to which a negative electrode is connected from the outside.
申请公布号 KR20040072281(A) 申请公布日期 2004.08.18
申请号 KR20030008282 申请日期 2003.02.10
申请人 KIM, TAE KEU 发明人 KIM, TAE KEU
分类号 C25D5/02;(IPC1-7):C25D5/02 主分类号 C25D5/02
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