发明名称 |
Cooling device with multiple compliant elements |
摘要 |
A cooling device having a common cooling distribution unit with multiple compliant cooling elements. Mechanisms are built in to ensure the cooling elements are in good thermal contact with heat generating semiconductor chips of different heights and sizes on a common carrier. The cooling distribution unit has protection structures to prevent the leakage of coolant from the unit. Further reduction of the risk of accidental coolant leakage is provided with the onboard storage of coolant absorbent materials in the coolant distribution unit. The cooling elements have serpentine coolant channels to enhanced the cooling capacity. The compliance of the cooling elements can also be achieved by using concentric tubing to connect the coolant distribution unit to cooling heads on the cooling elements.
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申请公布号 |
US6778393(B2) |
申请公布日期 |
2004.08.17 |
申请号 |
US20020308225 |
申请日期 |
2002.12.02 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
MESSINA GAETANO P.;MOK LAWRENCE S.;YUAN TSORNG-DIH |
分类号 |
H01L23/433;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/433 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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