| 摘要 |
PROBLEM TO BE SOLVED: To provide a mold-resin sealed semiconductor device which comprises a substrate having a plurality of chips mounted thereon and which is made thin, and also to provide a method for manufacturing the semiconductor device. SOLUTION: The semiconductor device comprises the silicon substrate 1, hanging pins 2, leads 3, a heat spreader 4, and heat spreader hanging pins 5. One end of each hanging pin 2 is bonded with an adhesive 25 to each of four corners of the surface of the substrate 1 each hanging pin 2 has a three-dimensional shape obtained by bending a plate, and the heat spreader 4 hung by the pins 5 is provided under the substrate 1. COPYRIGHT: (C)2004,JPO&NCIPI
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