| 摘要 |
PROBLEM TO BE SOLVED: To make the light receiving part of an optical semiconductor device, for example, with a lid precisely aligned so that the scattered light which is to be noises is suppressed from entering the light receiving part of the optical semiconductor device, by allowing a plurality of semiconductor devices to be precisely aligned with the lid and mounted on an insulating board. SOLUTION: The package for housing a semiconductor device is provided with an insulating board 1 so formed that a plurality of mounting parts of a semiconductor element 3, comprising a conductor layer, are arrayed on its upper surface, and a metal frame 2 jointed to the outer peripheral part on the upper surface of the insulating board 1 to enclose a plurality of mounting parts. A protruding part 2a is provided in a section of the inner periphery, of the metal frame 2, which is between the mounting parts. COPYRIGHT: (C)2004,JPO&NCIPI
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