发明名称 HEAT-RESISTANT THERMALLY CONDUCTIVE MATERIAL
摘要 <p>A heat-resistant thermally conductive material which comprises an organic-inorganic hybrid material which is prepared by heating a sol containing an alkoxide of a metal or a semimetal, an organic silicon compound and a good thermally conductive material to allow the sol to gelate. The organic-inorganic hybrid material exhibits excellent releasability and is less susceptible to adhesion of dust, toner or the like and is easy to remove the dust, a toner or the like even when it has been adhered thereto, and the good thermally conductive material imparts good heat radiating property to the organic-inorganic hybrid material, and thus the heat-resistant thermally conductive material is less susceptible to adhesion of a fine powder such as dust or a toner and exhibits good heat radiating property.</p>
申请公布号 WO2004067606(A1) 申请公布日期 2004.08.12
申请号 WO2004JP00007 申请日期 2004.01.05
申请人 SUZUKA FUJI XEROX CO., LTD.;SHINDO, TAKUYA 发明人 SHINDO, TAKUYA
分类号 C08K3/00;C08G77/398;C08G79/00;C08K5/057;C08K5/5419;C08L83/06;C08L85/00;(IPC1-7):C08G79/00 主分类号 C08K3/00
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