| 摘要 |
PROBLEM TO BE SOLVED: To provide a holding device effective for uniformizing the temperature of the heating surface of a semiconductor wafer in a holding section, in addition to the prevention of discharges at a conductive terminal section and corrosion of the conductive terminal section by a process gas and the shortening of the device lifetime and in addition to being quickly changeable the temperature of the heating surface of the holding section. SOLUTION: The semiconductor wafer holding device 20A has the semiconductor-wafer holding section 1, a cylindrical support member 9 jointed with the rear of the holding section 1 in an airtight manner, cooling members 4 for cooling the holding section 1 and a gas supply means 6 for controlling the quantity of a heat dissipated from the holding section 1, by supplying heat-transfer spaces 12 formed among the holding section 1 and the members 4 with a gas A. The discharge of the gas fed into the spaces 12 is prevented by a discharge preventive means 5. COPYRIGHT: (C)2004,JPO&NCIPI |
