INTERPOSER SUBSTRATE, SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, ELECTRONIC DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR MODULE

摘要

PROBLEM TO BE SOLVED: To enable lamination of a semiconductor chip even if arrangement of a terminal electrode is different, with no limit on chip size. SOLUTION: A slit 1a is formed on an interposer substrate 1. The slit 1a is so deployed outside the mounting region of a semiconductor chip 4 along the side of the semiconductor chip 4. COPYRIGHT: (C)2004,JPO&NCIPI