| 发明名称 |
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE AND ACCELERATION SENSOR |
| 摘要 |
<p>A technology for reducing the step coverage of photoresist at the time of forming an electrode being connected with a semiconductor substrate, e.g. a silicon substrate for mounting an acceleration sensor. An opening (80) for forming an electrode (90) is formed before a sacrifice layer (4), a semiconductor film (50) or a fixed electrode (51) is formed. A thick photoresist is thereby not required.</p> |
| 申请公布号 |
WO2004068591(A1) |
申请公布日期 |
2004.08.12 |
| 申请号 |
WO2003JP00859 |
申请日期 |
2003.01.29 |
| 申请人 |
OKUMURA, MIKA;MITSUBISHI DENKI KABUSHIKI KAISHA;HORIKAWA, MAKIO;SATOU, KIMITOSHI |
发明人 |
OKUMURA, MIKA;HORIKAWA, MAKIO;SATOU, KIMITOSHI |
| 分类号 |
G01P15/08;B81B3/00;G01P15/125;H01L21/28;H01L29/84;(IPC1-7):H01L29/84 |
主分类号 |
G01P15/08 |
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